Explore KappaX thermal interface materials for the connection between electronic components and thermal-management assemblies.
Evaluate thermal paste at the interface: bond-line thickness, contact pressure, electrical requirements and reliability under cycling.
KappaX discussions focus on the mating surfaces between a heat source and its thermal assembly. Provide the contact area, surface flatness, assembly gap and clamping method. Confirm dispensing and rework requirements before choosing a sample.
The legacy page lists conductivity and thermal impedance values. Request the current grade-specific datasheet with its test method, temperature, pressure and bond-line thickness before using those values in a design. Check electrical insulation and outgassing requirements independently.
Include thermal cycling, paste displacement, drying and rework in the evaluation plan. Compare initial and aged interface performance using the same assembly. Agree on the acceptance criteria and maintenance interval for your equipment.
No. Compare interface performance at the intended thickness and pressure, then review electrical, processing and aging requirements. Ask for a sample evaluation against your existing material.
Explore KappaX thermal interface materials for the connection between electronic components and thermal-management assemblies.
| Material family | Thermal interface materials |
|---|---|
| Application focus | Component-to-heatsink interfaces |
| Design discussion | Contact surfaces, assembly pressure, interface thickness and process |
| Evaluation scope | Assembly compatibility and application-specific performance |
Request the documents applicable to your selected material and intended use. Availability and revision should be confirmed with TiKOUS.
Discuss specifications and documentationShare your application. Let’s find the next step.
