AI compute & acceleratorsAI compute thermal design.
AI compute thermal design.
Built around the stack.
Discuss GPU and accelerator thermal interfaces, high-TDP server paths and fanless edge enclosures.
Make the thermal path explicit
AI compute is a market pull, not a claim about the material. Start with the die, interface, heatsink, enclosure and ambient conditions that define the real system.
The supplied AI accelerator image is an illustrative market visual. Embedded hardware labels are not TiKOUS specifications.
Questions for your application brief
- What package, accelerator and heatsink stack is being evaluated?
- Which interfaces contribute most to the thermal path?
- How will high-load and edge-enclosure conditions be represented?
An evaluation should reflect your actual assembly, operating conditions and project requirements. Share these details with TiKOUS before selecting a material.
Materials to discuss
GRAPHENE COATING
ExploreCoolRock
Heat-dissipation coatings for metal surfaces and heatsinks.
THERMAL INTERFACE MATERIALS
ExploreKappaX
Thermal interface materials for component-to-heatsink integration.
THERMAL INSULATION
ExploreAerogel insulation
Insulation materials for designs where heat protection and space matter.